Joining of Cu/Fe by Pulse Current Heating

Abstract

Pulse Current Heating (PCH) process is a new method characteristic with shorter time and lower temperature to the fabrication of materials. In the present paper, the PCH was used to join Cu/Fe. The microstructures of the joined samples were observed by optical microscope, the diffusions of elements near the interfaces were made qualitative and quantitative analyses by Electron Probe Mechanism. Diffusion coefficients of Cu and Fe at PCH and Radiation Heating (RH) joining methods were compared. The results showed that, the transition layer widths were from 5 to 8 μm when the Cu/Fe joined at 750 to 850°C under 5 MPa pressure with holding times 5 or 10 or 15min. Width of the transition layer increase with the increasing of joining temperature and the extension of holding time. The initial interface will move from the Cu side to the Fe one due to the Kirkendall effect. The diffusion coefficients both of Cu and Fe to PCH joining were larger by three orders of magnitude than those of RH joining. The differences between the two methods were analyzed from dynamics and thermodynamics.