Affiliation:
1. SunMoon University
2. Sun Moon University
3. Acqutek Semiconductor and Technology Co.
Abstract
A preplated frame (PPF) consisting of Au/Pd/Cu-Sn/Cu substrate, i.e., preplated with a
Cu-Sn alloy instead of Ni commercially used, was fabricated by electroplating and then the
feasibility of the frame as an alternative PPF was investigated. The wettability of the Cu-Sn alloy
was better than that of Ni, resulting in excellent contact with the substrate and smoother surface on
the upper Au/Pd protective layer. By XPS analyses, it was confirmed that Cu atoms in the Cu-Sn
alloy layer did not diffuse through the thin protective layer to the surface at temperatures used in IC
assembly. The wire pull-strength and solderability of the Cu-Sn alloy PPF were almost equivalent
to those of the Ni PPF. However, the former showed much better corrosion resistance than the latter.
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
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