Shear Speed Analysis on Sn-3.9Ag-0.6Cu Solder-Reference-Cited by-同舟云学术

Shear Speed Analysis on Sn-3.9Ag-0.6Cu Solder

Published:2013-09 Issue: Volume:404 Page:72-76
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Sauli Zaliman¹,Retnasamy Vithyacharan¹,Fuad Fairul Afzal Ahmad¹,Ehkan Phaklen¹,Say Ong Tee¹,Vairavan Rajendaran¹

Affiliation:

1. Universiti Malaysia Perlis (UniMAP)

Abstract

Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nanosize. The reliability of BGA in IC becomes a concern as the size of IC reduces. Hence, this leads to the study of stress on the BGA. This paper discussed the load effects of varying shear speed analysis on the BGA. A Pb-free material, Sn-3.9Ag-0.6Cu solder was applied in the simulation. Shear height value is fixed while the shear speed is varied to investigate the dynamic stress on a BGA package using Ansys software. The results from the graph plotted showed that higher shear speed results to higher shear force.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.404.72.pdf

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