Affiliation:
1. Chongqing University of Technology
Abstract
By the method of adding MNP (micron or nano particles) into general solder, the composite electronic solder can be prepared, due to its role of solution or dispersion strengthening, and can improve the thermostable fatigue and creep properties of solder joint, it is also usually named as RCS (reinforced composite solder).Based on researchful analysis of RCS, such as metal particles, particles for high hardness, particles for low expansion coefficient, rare-earth particles and low aggregated particle, and of their reinforced mechanism, the technical requirements of RCS is found, it is also analyzed problems and application prospects of RCS.
Publisher
Trans Tech Publications, Ltd.
Reference15 articles.
1. Liu ping. The study of lead-free electronic composite Sn3. 8Ag0. 7Cu solders for reinforced particles [D]. Tianjin: Tianjin University, (2009).
2. F. Guo, Composite lead-free electronic solders, Journal of Materials and Science: Materials Electronics [J], 2007, 18: 129-45.
3. K. Mohan kumar, A. A.O. Tay, Nano-Particle Reinforced Solders for fine pitch Applications, Electronics Packaging Technology Conference [J], 2004: 455-461.
4. YanYanFu, etal. Creep rupture and enhancement mechanism of Ag particle-enhancement composite solder joints [J]. Materials Science and Technology, 2009, 17(3): 418-421.
5. D.C. Lin G.X. Wang, etal. Influence of titanium dioxide nano-powder addition on micro-structural development and hardness of tin–lead solder, Materials Letters, 200357: 3193-3198.
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