Affiliation:
1. Queensland University of Technology
2. Harbin Institute of Technology
3. Samsung Semiconductor(China)R&D CO.LTD
Abstract
This paper presents bonding technology of aluminum alloy by hot-dipping tin. The
dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn.
Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate
characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were
analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested
as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.
Publisher
Trans Tech Publications, Ltd.
Cited by
4 articles.
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