Affiliation:
1. Southeast University Chengxian College
Abstract
Strengthening the study on whiskers influence on the reliability of lead-free soldering can improve welding technology and contribute to the overall development of the electronics industry. This paper provides an overview of the study on lead-free solder technology and development, summaries the materials, processes and other reliability issues and welding reliability problems of lead-free solder, finally gives an overview of the research status of whiskers formation mechanism and reliability.
Publisher
Trans Tech Publications, Ltd.
Reference6 articles.
1. Zeng K; Tu K N Six cases of reliability study of Pbfree solders joints in electronic packing technology, 2002(02): 67-68.
2. Xiao W M; Shi Y W; Lei Y P In situ scanning electron microscopy observation of tensile deformation in Sn-Ag-Cu alloys containing rare-earth elements , 2008(11)：56-57.
3. Shi Y W；Tian J; Hao H Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder, 2008(04): 23-24.
4. Lau J H; Wong C P; Lee N C Electronics Manufacturing 2002(9): 15-16.
5. Dittes M; Oberndorff P; Pctit L Tin whisker formation-results, test methods and countermeasures, 2003(10): 23-24.