On-Chip Tensile Testing of the Mechanical and Electro-Mechanical Properties of Nano-Scale Silicon Free-Standing Beams

Author:

Bhaskar Umesh1,Passi Vikram1,Zulfiqar Azeem1,Södervall Ulf2,Nilsson Bengt2,Petersson Goran2,Hagberg Mats2,Pardoen Thomas3,Raskin Jean Pierre1

Affiliation:

1. Université catholique de Louvain

2. Chalmers University of Technology

3. Institute of Mechanics, Materials and Civil Engineering, Université catholique de Louvain

Abstract

A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mechanical strength of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strength of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

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