Affiliation:
1. Slovak University of Technology in Bratislava
Abstract
The work deals with soldering of silicon substrate with active solders designated S-Bond 220-1, 220-50 and 220-M. Soldering was performed with power ultrasound in the air without flux application at temperature 250 to 280 °C. The results of EDX analysis have shown that active elements as Ti, Ce and Mg support wetting of Si substrate and thus assure the joint formation. Strength of joints was studied by shear test. The highest strength was achieved with S-Bond 220-1 solder. The strength of joints fabricated with S-bond solders on Si substrate varied from 23 to 38 MPa.
Publisher
Trans Tech Publications, Ltd.
Reference10 articles.
1. Y. Zhang, D. Feng, Z. He, X. Chen, Progress in Joining Ceramics to Metals, Journal of Iron and Streel Research, International, Vol. 13(2), 2006, pp.01-05.
2. R. Koleňák, M. Chachula, Soldering high-purity materials with Cu substrate, Annals of DAAAm and Proceedings of DAAAM Symposium, Vol. 22, No. 1, 2011, Vienna, Austria, pp.1011-1012.
3. M. Chen, C. Peng, X. Chen, S. Liu, Study on Microstructures and tensile properties of active solder alloy, Electronic Components and Technology Conference, 2011, pp.1736-1739.
4. R. Koleňák, M. Chachula, P. Šebo, M. Koleňáková, Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics, Soldering &Surface Mount Technology, Vol. 23, Is. 4, 2011, pp.224-228.
5. C. Peng, M. Chen, S. Liu, Die Bonding of Silicon and Other Materials with Active Solder, International Conference on Electronic Packaging Technology and High Density Packaging, 2010, pp.275-278.