Affiliation:
1. Moscow State University of Civil Engineering
Abstract
The article considers the one-dimensional problem of the destruction of the simplest model of adhesively engage consisting generally of the many plates, which are substrates (what are glued) and adhesives (glues). The ability of the model to resist to thermal impact without fracturing here conventionally called the thermal strength. The problem is solved in the elastic formulation.
Publisher
Trans Tech Publications, Ltd.
Reference7 articles.
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4. Turusov R.A., Manevich L.I. Contact Layer Method: Determining Parameters of Rigidity and True Strength of an Adhesion Bond for a Contact Layer. (Electronic publication). Polymer Science, Series D, Glues and Sealing Materials, DOI 11. 1135/S19954212100.
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10 articles.
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