Strain-Rate Characteristic of the Brush Plated Nanocrystalline Cu

Abstract

In this study, the pure nanocrystalline Cu columns were fabricated by the brush electrodeposition technique at 20°C and at different deposition current densities in the range of 200 240 mA cm-2. The columns shows high strain rate sensitivity in the room temperature compressive test. In the tested strain rate range, the strength of the nanocrystalline Cu at 2% plastic strain increases from 660 MPa to 1500 MPa. The nanocrystalline Cu exhibits obvious flow softening behavior at high strain level, and the degree of the softening is related to the strain rate.