Aluminum-Induced Crystallization of p+ Silicon Pinholes for the Formation of Rear Passivation Contact in Solar Cell

Abstract

Formation of nano-crystalline p+ silicon (Si) in pinholes through a silicon dioxide layer was achieved by pinning of aluminum through the thin silicon dioxide (SiO2) layer. In addition to opening holes of SiO2 layer by aluminum (Al) pining, amorphous silicon (a-Si) was subsequent deposited on the Al layer and another heated at low temperature (500°C) to allow solid- phase epitaxial growth of p+ Si in the pinholes due to the Al induced layer exchange process. The poly-crystalline p+ Si obtains lower effective surface recombination than the Al back surface field (BSF). The technique demonstrated to result in ohmic contacts with low contact resistance. The evaluation of Al-induced crystallization of a-Si in a-Si/Al bilayer was studied by X-ray diffraction. In this paper, the influence of a-Si/Al thickness ratio on the specific conductivity value and crystalline grain size of the p+ Si thin film is discussed. The obtained results are helpful for a further design of the rear passivation contact in solar cell.