Dry Etching Technologies of Optical Device and III-V Compound Semiconductors

Author:

KAMIMURA Ryuichiro1,FURUTA Kanji1

Affiliation:

1. ULVAC

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. [1] N. Inoue, H. Yagi, R, Masuyama, T. Katsuyama, Y. Yoneda, and H. Shoji, “InP-based Photodetector Monolithically Integrated with 90° Hybrid for 100 Gbit/s Compact Coherent Receivers,” SEI TECHNICAL REVIEW · NUMBER 79 · OCTOBER 2014 · 71.

2. [2] C. Hedlund, H.-O. Blom, and S. Berg, “Microloading effect in reactive ion etching,” J. Vac. Sci. Technol. A, vol.12, no.4, 1962, 1994.

3. [3] K. Tadatomo, H. Okagawa, Y. Ohuchi, T. Tsunekawa, Y. Imada, M. Kato, and T. Taguchi, “High Output Power InGaN Ultraviolet Light-Emitting Diodes Fabricated on Patterned Substrates Using Metalorganic Vapor Phase Epitaxy,” Jpn. J. Appl. Phys., vol.40, pp.L583-L585, 2001.

4. [4] M. Yamada, T. Mitani, Y. Narukawa, S. Shioji, I. Niki, S. Sonobe, K. Deguchi, M. Sano, and T. Mukai, “InGaN-Based Near-Ultraviolet and Blue-Light-Emitting Diodes with High External Quantum Efficiency Using a Patterned Sapphire Substrate and a Mesh Electrode,” Jpn. J. Appl. Phys., vol.41, pp.L1431-L1433, 2002.

5. [5] S. Noda and M. Imada, “2D Photonic Crystal Surface-Emitting Laser Using Triangular-Lattice Structure,” IEICE Trans. Electron., vol.E85-C, no.1, pp.45-51, 2002.

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