Interconnect-Driven Floorplanning with Noise-Aware Buffer Planning
Author:
Affiliation:
1. Department of Computer Science and Engineering, National Sun Yat-Sen University
2. Department of Electrical Engineering, National Dong-Hwa University
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Applied Mathematics,Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Signal Processing
Link
https://www.jstage.jst.go.jp/article/transfun/E96.A/12/E96.A_2467/_pdf
Reference22 articles.
1. [1] Semiconductor Industry Association, National Technology Road-map for Semiconductors 1999 Edition, Nov. 1999.
2. [2] C.J. Alpert and A. Devgan, “Wire segmenting for improved buffer insertion,” Proc. DAC, pp.588-593, 1997.
3. [3] J. Cong, T. Kong, and D.Z. Pan, “Buffer block planning for interconnect-driven floorplanning,” Proc. ICCA, pp.358-363, 1999.
4. [4] J. Cong, T. Kong, and, D.Z. Pan, “Buffer block planning for interconnect planning and prediction,” IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol.9, no.6, pp.929-937, 2001.
5. [5] P. Sarkar and C.K. Koh, “Routability-driven repeater block planning for interconnect-centric floorplanning,” IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., vol.20, no.5, pp.660-671, 2001.
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