Low-power and small-area 4-ch 25-Gb/s transimpedance amplifiers in 65-nm CMOS process
Author:
Affiliation:
1. Faculty of Engineering, Gifu University
2. School of Engineering, The University of Shiga Prefecture
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/elex/20/18/20_20.20230339/_pdf
Reference33 articles.
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2. [2] “Co-packaged optics collaboration,” (2021) http://www.copackagedoptics.com (accessed on 10 Feb. 2023).
3. [3] F. Koyama: “High-speed VCSEL photonics for datacenter networks,” Invited Lecture Notes of 2022 URSI-Japan Radio Science Meeting (JRSM 2022) (2022) http://www.ursi.jp/content/files/JRSM2022/ComD_Invited_Fumio_Koyama_URSI-JRSM-2022.pdf (accessed on 11 Feb. 2023).
4. [4] C. Minkenberg, et al.: “Co-packaged datacenter optics: Opportunities and challenges,” IET Optoelectronics 15 (2021) 77 (DOI: 10.1049/ote2.12020).
5. [5] S.-M. Park and H.-J. Yoo: “1.25-Gb/s regulated cascode CMOS transimpedance amplifier for Gigabit Ethernet applications,” IEEE J. Solid-State Circuits 39 (2004) 112 (DOI: 10.1109/JSSC.2003.820884).
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1. A 0.06 mm2, 0.9 pJ/bit, 25 Gb/s Optical Receiver Front-End Module in 65 nm CMOS;2024 13th International Conference on Communications, Circuits and Systems (ICCCAS);2024-05-10
2. A 16-Channel Optical Receiver Circuit for a Multicore Fiber-Based Co-Packaged Optics Module in a 65-nm CMOS Chip;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-05
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