Microtextured die using silicon stencil mask for micro-machining of stainless steel

Abstract

Abstract Taking advantage that silicon (Si) can be processed realizing the fine structure with a high-aspect-ratio, a through-hole structure is applied as the hard mask for Ar+ ion-based dry etching of metal materials. Conventionally, the micro texturing of metal materials has the problem of the lack of the appropriate mask, which should be hard and high-temperature proof enabling the fine pattern. Si hard mask with about 2 μm wide through-hole structures is fabricated and used for realizing the fine and deep structure on the die material (SKD11 of the standard alloy tool steel). The aspect ratio of the trench obtained is about 2, confirming the effectiveness of the Si hard mask. The die is applied for pressing SUS304 steel transferring the microstructure. The realized embossed structure has an aspect ratio larger than 1.