Thermal Management of Electronic packages using Al2O3/water Nanofluid as Coolant in microchannel heat sink
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Begellhouse
Reference21 articles.
1. Tuckerman, David B., and Roger Fabian W. Pease. 'High-performance heat sinking for VLSI.' IEEE Electron device letters 2, no. 5 (1981): 126-129.
2. Deng, Daxiang, Long Zeng, and Wei Sun. 'A review on flow boiling enhancement and fabrication of enhanced microchannels of microchannel heat sinks.' International Journal of Heat and Mass Transfer 175 (2021): 121332.
3. Mohammed, H. A., G. Bhaskaran, N. H. Shuaib, and Rahman Saidur. 'Heat transfer and fluid flow characteristics in microchannels heat exchanger using nanofluids: a review.' Renewable and Sustainable Energy Reviews 15, no. 3 (2011): 1502-1512.
4. Bahiraei, Mehdi, and Saeed Heshmatian. 'Electronics cooling with nanofluids: A critical review.' Energy Conversion and Management 172 (2018): 438-456.
5. Ma, D. D., G. D. Xia, W. Wang, Y. T. Jia, and Y. C. Yang. 'Study on thermal performance of microchannel heat sinks with periodic jetting and throttling structures in sidewalls.' Applied Thermal Engineering 158 (2019): 113764.
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