Effects of Si Addition and Heating Ar on the Electromigration Performance of Al-Alloy Interconnects-Reference-Cited by-同舟云学术

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Effects of Si Addition and Heating Ar on the Electromigration Performance of Al-Alloy Interconnects

Published:2002-02-15 Issue:Part 1, No. 2A Volume:41 Page:557-561
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Lee Dok Won,Lee Byung-Zu,Jeong Jong Yeul,Park Hyun,Shim Kyu Cheol,Kim Jong Seok,Park Young Bae,Woo Sun-Woong,Lee Jeong-gun

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/41/i=2R/a=557/pdf

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