Effects of Underlayer Dielectric on the Thermal Characteristics and Electromigration Resistance of Copper Interconnect
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/42/i=12R/a=7502/pdf
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Reinforcement in electromigration reliability of Cu interconnects by alloying of extremely dilute MnO;Journal of Alloys and Compounds;2023-08
2. Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer;Journal of The Electrochemical Society;2022-08-01
3. Design and Validation of Reliability Physics for Interconnect Architectures Induced from Inclusive TM/SM/EM Effects;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
4. Simulation and Experimental Validations of EM/TM/SM Physical Reliability for Interconnects Utilized in Stretchable and Foldable Electronics;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05
5. Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending;Intermetallics;2016-09
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