Comparative Study of Plasma-Charging Damage in High-$k$ Dielectric and p–n Junction and Their Effects on Off-State Leakage Current of Metal–Oxide–Semiconductor Field-Effect Transistors
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference13 articles.
1. Quantitative and comparative characterizations of plasma process-induced damage in advanced metal-oxide-semiconductor devices
2. Quantitative Evaluation of Gate Oxide Damage during Plasma Processing Using Antenna-Structure Capacitors
3. High-κ gate dielectrics: Current status and materials properties considerations
4. Plasma charging damage on MOS devices with gate insulator of high-dielectric constant material
5. Comparative Study of Plasma Source-Dependent Charging Polarity in Metal–Oxide–Semiconductor Field Effect Transistors with High-kand SiO2Gate Dielectrics
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1. Electron Plasma Charging Effects on the Biocompatible Electrospun Dielectric Fibers;IEEE Transactions on Plasma Science;2022-01
2. Defect generation in electronic devices under plasma exposure: Plasma-induced damage;Japanese Journal of Applied Physics;2017-05-25
3. Mechanisms of silicon damage during N2/H2 organic etching for fin field-effect-transistor CMOS;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2015-09
4. Impacts of plasma process-induced damage on MOSFET parameter variability and reliability;Microelectronics Reliability;2015-08
5. Molecular dynamics simulation of silicon oxidation enhanced by energetic hydrogen ion irradiation;Journal of Physics D: Applied Physics;2015-03-25
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