Effect of Sintering Temperature on Electrical Properties of Chip on Glass Module with Direct Printing Method
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Published:2012-09-20
Issue:
Volume:51
Page:09MJ04
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ISSN:0021-4922
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Container-title:Japanese Journal of Applied Physics
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language:en
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Short-container-title:Jpn. J. Appl. Phys.
Author:
Lee Young-Chul,Kim Yongil,Jung Seung-Boo
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering