A New Metal–Insulator–Metal Capacitor with Nickel Fully Silicided Polycrystalline Silicon Electrodes
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference37 articles.
1. Ultrahigh Capacitance Density for Multiple ALD-Grown MIM Capacitor Stacks in 3-D Silicon
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3. Copper Compatible Barium Titanate Thin Films for Embedded Passives
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Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Cost-Effective $\hbox{Ni/Nb}_{2}\hbox{O}_{5}\hbox{/} \hbox{Al}_{2}\hbox{O}_{3}\hbox{/}\hbox{Ni}_{2}\hbox{Si}$ Metal–Insulator–Metal Capacitor Processed at 300 $^{\circ}\hbox{C}$ Using Laser Annealing and a Fully Silicided Amorphous Silicon Bottom Electrode;IEEE Transactions on Electron Devices;2011-11
2. Comparison of Multilayer Dielectric Thin Films for Future Metal–Insulator–Metal Capacitors: Al$_{2}$O$_{3}$/HfO$_{2}$/Al$_{2}$O$_{3}$ versus SiO$_{2}$/HfO$_{2}$/SiO$_{2}$;Japanese Journal of Applied Physics;2011-10-20
3. Comparison of Multilayer Dielectric Thin Films for Future Metal–Insulator–Metal Capacitors: Al2O3/HfO2/Al2O3versus SiO2/HfO2/SiO2;Japanese Journal of Applied Physics;2011-10-01
4. A New Cost-Effective Metal–Insulator–Metal Capacitor Processed at 350 $^{\circ}\hbox{C}$ Using $ \hbox{Ni}_{2}\hbox{Si}$ Fully Silicided Amorphous Silicon Electrodes;IEEE Transactions on Electron Devices;2011-03
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