Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards-Reference-Cited by-同舟云学术

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Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

Published:2008-05-23 Issue:5 Volume:47 Page:4300-4304
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Lee Jong-Bum,Koo Ja-Myeong,Hong Soon-Min,Shin Hyoyoung,Moon Young-jun,Jung Jae-Pil,Yoo Choong-Don,Jung Seung-Boo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference7 articles.

1. Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding

2. Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 µm Pitch

3. Temperature Rise and Welding Characteristics of Various-Frequency Ultrasonic Plastic Welding Systems

4. Ultrasonic Plastic Welding at 1.2 MHz using a Surface Acoustic Wave Device

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Copper cladding on polymer surfaces by ionization-assisted deposition;Japanese Journal of Applied Physics;2018-02-09

2. Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints;MATERIALS TRANSACTIONS;2016

3. Ultrasonic-Vibration Assisted Manufacturing Technology;Journal of the Japan Society for Technology of Plasticity;2015

4. Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test;Microelectronics Reliability;2013-12

5. Flexible printed circuit boards laser bonding using a laser beam homogenization process;Optics and Lasers in Engineering;2012-11

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