Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference17 articles.
1. Copper metallization reliability
2. Copper CMP evaluation: planarization issues
3. Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing
4. The Compatibility of Copper CMP Slurries with CMP Requirements
5. Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing
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1. Ultrasensitive surface-enhanced Raman spectroscopy detection of gaseous sulfur-mustard simulant based on thin oxide-coated gold nanocone arrays;Journal of Hazardous Materials;2021-10
2. Characterization of Different Cobalt Surfaces and Interactions with Benzotriazole for CMP Application;ECS Journal of Solid State Science and Technology;2020-07-10
3. Growth kinetics of Cu surface layers in H2O2–BTA aqueous solutions;Japanese Journal of Applied Physics;2020-04-15
4. Structures of Cu surfaces developing in benzotriazole solutions: Effect of pH;Japanese Journal of Applied Physics;2017-06-23
5. Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces;Lubricants;2017-05-23
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