(Invited) Heterogeneous Integration of Ultra-Thin Sheets of Alternative Materials onto Silicon Substrates

Abstract

Electric-field-assisted assembly is used to position ultra-thin, micron-sized sheets of alternative materials in high density arrays on silicon substrates. Dielectrophoretic forces induced on the solution-suspended polarizable sheets by a spatially varying, non-uniform electric field attract and align the sheets to lithographically defined assembly electrodes on the substrate. Studying the assembly of 10 µm long, 100 nm thick chromium sheets fabricated in three different widths of 1.2, 2.4, and 3.0 µm showed that the maximum array density decreases with increasing width. This result provides insight into the assembly of sheets composed of doped semiconductor device layers and junctions.