The Crack Opening Method in Silicon Wafer Bonding: How Useful Is It?-Reference-Cited by-同舟云学术

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The Crack Opening Method in Silicon Wafer Bonding: How Useful Is It?

Published:1997-01-01 Issue:1 Volume:144 Page:354-357
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Martini T.¹,Steinkirchner J.¹,Gösele U.¹

Affiliation:

1. Max‐Planck‐Institute of Microstructure Physics, D‐06120 Halle/Saale, Germany

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1837409/pdf

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