Author:
Lim W. T.,Baek I. G.,Jung P. G.,Lee J. W.,Cho G. S.,Lee J. I.,Cho K. S.,Pearton S. J.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. High Aspect Ratio Deep Via Holes in InP Etched Using Cl2 / Ar Plasma
2. Characterization of Cl2/Ar high density plasmas for semiconductor etching
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4. Low‐Pressure Etching of Nanostructures and Via Holes Using an Inductively Coupled Plasma System
5. C. Youtsey and I. Adesida, inHandbook of Advanced Plasma Processing Techniques, R. J. Shul, Editor, Chap. 11, Springer Berlin (2000).
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