Design and Performance of a Controlled Atmosphere Polisher for Silicon Crystal Polishing-Reference-Cited by-同舟云学术

Design and Performance of a Controlled Atmosphere Polisher for Silicon Crystal Polishing

Published:2004 Issue:8 Volume:7 Page:G158
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Doi Toshiro,Philipossian Ara,Ichikawa Koichiro

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference7 articles.

1. S. Kondo, S. Tokitou, and B. U. Yoon, Proceedings of the VMIC Conference , Sept. 19–20, 2002, p. 87.

2. T. K. Doy, F. Makii, M. Kinoshita, and T. Kasai, Abstract K77, p. 515, 2002 Spring Meeting of the Japan Society for Precision Engineering (in Japanese).

3. T. Karaki and J. Watanabe, in ASME/Wear of Materials , p. 227, New York (1983).

4. Impact of Chemomechanical Polishing on the Chemical Composition and Morphology of the Silicon Surface

5. RIKAGAKU JITEN , CD-ROM version, S. Nagakura, Editor, (2003) Iwanami-shoten (in Japanese).

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chemical and physical mechanisms of CMP of gallium nitride;Advances in Chemical Mechanical Planarization (CMP);2022

2. Effect of Using High-Pressure Gas Atmosphere with UV Photocatalysis on the CMP Characteristics of a 4H-SiC Substrate;ECS Journal of Solid State Science and Technology;2021-02-01

3. Chemical and physical mechanisms of CMP of gallium nitride;Advances in Chemical Mechanical Planarization (CMP);2016

4. Applications to Optoelectronics Materials;Handbook of Ceramics Grinding and Polishing;2015

5. Chemical Mechanical Machining Process;Handbook of Manufacturing Engineering and Technology;2014-09-30