Study on Effective Methods and Mechanism of Inhibiting Cobalt Removal Rate in Chemical Mechanical Polishing of GLSI Low-Tech Node Copper Film
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference32 articles.
1. The influence of abrasive particle size in copper chemical mechanical planarization
2. Inhibition Mechanism of Benzotriazole in Copper Chemical Mechanical Planarization
3. Evaluating the Large Electromigration Resistance of Copper Interconnects Employing a Newly Developed Accelerated Life‐Test Method
4. Chemical processes in the chemical mechanical polishing of copper
5. Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI
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1. Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study;Journal of The Electrochemical Society;2023-10-01
2. Study on inhibition effect of 3-amino-1, 2, 4-triazole on chemical mechanical polishing of GLSI low-techology node molybdenum barrier layer;Materials Science in Semiconductor Processing;2023-08
3. Monodispersion of SiO2/CeO2 Binary Nano-Abrasives with Adjustable Size in Chemical Mechanical Polishing Performance of Copper;ECS Journal of Solid State Science and Technology;2023-07-01
4. Study on the surface interaction mechanism, corrosion inhibition effect and the synergistic action of potassium oleate and fatty alcohol polyoxy ethylene ether on copper film chemical mechanical polishing for giant large scale integrated circuit;Thin Solid Films;2023-06
5. Surface Corrosion Inhibition Effect and Action Mechanism Analysis of 5-Methyl-Benzotriazole on Cobalt-Based Copper Film Chemical Mechanical Polishing for GLSI;ECS Journal of Solid State Science and Technology;2023-04-01
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