1. D. Edelstein, C. Davis, L. Clevenger, M. Yoon, A. Cowley, T. Nogami, H. Rathore, B. Agarwala, S. Arai, A. Carbone, K. Chanda, S. Cohen, W. Cote, M. Cullinan, T. Dalton, S. Das, P. Davis, J. Demarest, D. Dunn, C. Dziobkowski, R. Filippi, J. Fitzsimmons, P. Flaitz, S. Gates, J. Gill, A. Grill, D. Hawken, K. Ida, D. Klaus, N. Klymko, M. Lane, S. Lane, J. Lee, W. Landers, W.-K. Li, Y.-H. Lin, E. Liniger, X.-H. Liu, A. Madan, S. Malhotra, J. Martin, S. Molis, C. Muzzy, D. Nguyen, S. Nguyen, M. Ono, C. Parks, D. Questad, D. Restaino, A. Sakamoto, T. Shaw, Y. Shimooka, A. Simon, E. Simonyi, S. Tempest, T. Van Kleeck, S. Vogt, Y.-Y. Wang, W. Wille, J. Wright, C.-C. Yang, and T. Ivers ,Proceedings of the IEEE 2004 International Interconnect Technology Conference, IEEE, Piscataway, NJ (IEEE Catalog No. 04TH8729) p. 214 (2004).
2. A. Grill, D. Edelstein, D. Restaino, M. Lane, S. Gates, E. Liniger, T. Shaw, X.-H. Liu, D. Klaus, V. Patel, S. Cohen, E. Simonyi, N. Klymko, S. Lane, K. Ida, S. Vogt, T. Van Kleeck, C. Davis, M. Ono, T. Nogami, and T. Ivers ,Proceedings of the IEEE 2004 International Interconnect Technology Conference, IEEE, Piscataway, NJ (IEEE Catalog No. 04TH8729) p. 54 (2004).
3. Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
4. Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma
5. T. C. Dalton, N. Fuller, C. Tweedy, D. Dunn, C. Labelle, S. Gates, M. Colburn, S. T. Chen, L. Tai, R. Dellaguardia, K. Petrarca, C. Dziobkowski, K. Kumar, and S. Siddiqui ,Proceedings of the IEEE 2004 International Interconnect Technology Conference, IEEE, Piscataway, NJ (IEEE Catalog No. 04TH8729) p. 154 (2004).