(3-Aminopropyl)trimethoxysilane Self-Assembled Monolayer as Barrier of Porous SiOCH for Electroless Cu Metallization: Optimizations of SiOCH Hydroxylation and Monolayer Functionalization-Reference-Cited by-同舟云学术

(3-Aminopropyl)trimethoxysilane Self-Assembled Monolayer as Barrier of Porous SiOCH for Electroless Cu Metallization: Optimizations of SiOCH Hydroxylation and Monolayer Functionalization

Published:2021-02-01 Issue:2 Volume:10 Page:023003
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Fang Jau-Shiung^ORCID,Yang Tzu-Ming,Cheng Yi-Lung^ORCID,Chen Giin-Shan^ORCID

Funder

Ministry of Science and Technology, Taiwan

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/2162-8777/abe094/pdf

Reference44 articles.

1. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

2. Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages

3. Highly adhesive electroless barrier/Cu-seed formation for high aspect ratio through-Si vias

4. Application of Self-Assembled Monolayers to the Electroless Metallization of High Aspect Ratio Vias for Microelectronics

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1. Self-assembly hollow magnetoelectric composites emerging tunable property between microwave absorption and shielding with light-weight and broad bandwidth;Journal of Alloys and Compounds;2023-06

2. Thermal Stability of Self-Assembled 3-Aminopropyltrimethoxysilane Diffusion Barrier Terminated by Carboxyl Groups;Applied Sciences;2022-11-02

3. Strengthening the Electromigration Resistance of Nanoscaled Copper Lines by (3-aminopropyl)trimethoxysilane Self-Assembled Monolayer;ECS Journal of Solid State Science and Technology;2021-08-01