Inhibition Effect of TT-LYK on Cu Corrosion and Galvanic Corrosion between Cu and Co during CMP in Alkaline Slurry
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference48 articles.
1. Copper metallization reliability
2. Chemical processes in the chemical mechanical polishing of copper
3. BEOL Cu CMP Process Evaluation for Advanced Technology Nodes
4. Galvanic corrosion behavior of copper/titanium galvanic couple in artificial seawater
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