Real-Time Shear and Normal Force Trends in Tungsten Chemical Mechanical Planarization with Different Conditioning Discs-Reference-Cited by-同舟云学术

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Real-Time Shear and Normal Force Trends in Tungsten Chemical Mechanical Planarization with Different Conditioning Discs

Published:2018 Issue:5 Volume:7 Page:P221-P227
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Peckler L.^ORCID,Mu Y.,Stuffle C.^ORCID,Sampurno Y.,Philipossian A.

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference28 articles.

1. http://www.axustech.com/newsletter-archive/icpt-honors-dr-klaus-beyer-for-cmp-discovery.

2. Milestones in a Quarter Century of CMP - Plenary

3. http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7411946.

4. Babu S. , Advances in Chemical Mechanical Planarization (CMP), Woodhead Publishing, (2016).

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process;ECS Journal of Solid State Science and Technology;2019

2. Correlating Removal Rate to Directivity in Copper Chemical Mechanical Planarization;ECS Journal of Solid State Science and Technology;2019

3. Insights into the Tribological and Kinetic Attributes of Retaining Rings in Chemical Mechanical Planarization;ECS Journal of Solid State Science and Technology;2018

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