Effect of Ceria Abrasive Synthesized by Supercritical Hydrothermal Method for Chemical Mechanical Planarization
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Hoefflinger B. , in Chips 2020, p. 161, Springer (2011).
2. Introduction
3. Nano-scale scratching in chemical–mechanical polishing
4. Influence of CMP Slurries and Post-CMP Cleaning Solutions on Cu Interconnects and TDDB Reliability
5. Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions
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