Characterization and Modeling of Dynamic Thermal Behavior in CMP-Reference-Cited by-同舟云学术

Characterization and Modeling of Dynamic Thermal Behavior in CMP

Published:2003 Issue:4 Volume:150 Page:G271
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

White David,Melvin Jason,Boning Duane

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. H. Chiou, Z. Lin, L. Kuo, S. Shih, L. Chen, and C. Hsia, Paper presented at theIEEE International Interconnect Technology Conference, San Francisco, CA (1999).

2. T. Park, T. Tugbawa, D. Boning, C. Borst, G. Shinn, and P. Chidambaram, Paper present at theAVS CMP Users Group (CMPUG) Annual Symposium, San Jose, CA (2001).

3. D. White, Sc.D. Dissertation, MIT, Cambridge, MA (2001).

4. T. Smith, Ph.D. Dissertation, MIT, Cambridge, MA (1999).

5. T. Tugbawa, T. Park, D. Boning, L. Camilletti, M. Brongo, and P. Lefevre, inProceedings of the 6th International CMP-MIC, p. 65, Santa Clara, CA (2001).

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