Nanoscale Chemical-Mechanical Characterization of Nanoelectronic Low-kDielectric/Cu Interconnects-Reference-Cited by-同舟云学术

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Nanoscale Chemical-Mechanical Characterization of Nanoelectronic Low-kDielectric/Cu Interconnects

Published:2015-10-15 Issue:4 Volume:5 Page:P3018-P3024
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Lo Michael K. F.,Dazzi Alexandre,Marcott Curtis A.,Dillon Eoghan,Hu Qichi,Kjoller Kevin,Prater Craig B.,King Sean W.

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference70 articles.

1. International Technology Roadmap for Semiconductors (ITRS): 2013 (Semiconductor Industry Association, San Jose, CA, 2013). http://www.itrs.net/.

2. Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies

3. Micro-thermal analysis: scanning thermal microscopy and localised thermal analysis

4. SCANNING THERMAL MICROSCOPY

5. Nanoscale elastic-property measurements and mapping using atomic force acoustic microscopy methods

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