1. Damascene copper electroplating for chip interconnections
2. Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives
3. J. Reid and S. Mayer, inAdvanced Metallization Conference 1999, p. 53, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Editors, MRS, Warrendale, PA (2000).
4. T. Ritzdorf, D. Fulton, and L. Chen, inAdvanced Metallization Conference 1999, p. 101, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Editors, MRS, Warrendale, PA (2000).
5. E. Richard, I. Vervoort, S. H. Brongersma, H. Bender, G. Beyer, R. Palmans, S. Lagrange, and K. Maex, inAdvanced Metallization Conference 1999, p. 149, M. E. Gross, T. Gessner, N. Kobayashi, and Y. Yasuda, Editors, MRS, Warrendale, PA (2000).