Solution Delivery of Cu ( hfac ) 2 for Alcohol‐Assisted Chemical Vapor Deposition of Copper-Reference-Cited by-同舟云学术

Solution Delivery of Cu ( hfac ) 2 for Alcohol‐Assisted Chemical Vapor Deposition of Copper

Published:1999-03-01 Issue:3 Volume:146 Page:1041-1045
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Borgharkar Narendra S.¹,Griffin Gregory L.¹,Fan Hui²,Maverick Andrew W.²

Affiliation:

1. Department of Chemical Engineering

2. Department of Chemistry, Louisiana State University, Baton Rouge, Louisiana 70803-7303, United States of America

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1391718/pdf

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