High-Performance Metal Hard Mask Process Using Fiber-Textured TiN Film for Cu Interconnects-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

High-Performance Metal Hard Mask Process Using Fiber-Textured TiN Film for Cu Interconnects

Published:2016 Issue:9 Volume:5 Page:P489-P494
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Torazawa Naoki,Harada Takeshi,Kabe Tatsuya,Inagaki Daisuke,Morinaga Yasunori,Motojima Dai,Matsumoto Susumu

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference48 articles.

1. Interaction of Hydrogen Plasma with Extreme Low-k SiCOH Dielectrics

2. A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology

3. Pore Sealing by NH[sub 3] Plasma Treatment of Porous Low Dielectric Constant Films

4. Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH[sub 3] Plasma

5. Copper Wire Bonding in High Volume Manufacturing

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review—Beyond the Highs and Lows: A Perspective on the Future of Dielectrics Research for Nanoelectronic Devices;ECS Journal of Solid State Science and Technology;2019

2. High-Performance Extremely Low-k Film Integration Technology with Metal Hard Mask Process for Cu Interconnects;ECS Journal of Solid State Science and Technology;2016

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3