Metal‐to‐Metal Bonding Using an Oxidizing Ambient Atmosphere-Reference-Cited by-同舟云学术

Metal‐to‐Metal Bonding Using an Oxidizing Ambient Atmosphere

Published:1988-04-01 Issue:4 Volume:135 Page:1023-1025
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Nayak Deepak¹²³,Reisman Arnold¹²³,Turlik Iwona¹²³

Affiliation:

1. Microelectronics Center of North Carolina (MCNC), Research Triangle Park, North Carolina 27709

2. Microelectronics Center of North Carolina, Research Triangle Park, North Carolina 27709 and Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, North Carolina 27695

3. Microelectronics Center of North Carolina, Research Triangle Park, North Carolina 27709 and MCNC Resident Professional, Bell Northern Research, Research Triangle Park, North Carolina 27709

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2095762/pdf

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