Impact of the Applied Potential on the Copper Nucleation

Abstract

In this work, we propose an alternative way to produce thin film solar cells (CIGS or CZTS) using an electrodeposition process presenting the advantage to be less constraining and cheaper than CVD or PVD processes. The first technologic key point consists in the deposition of a thin (~100 nm), uniform and adherent copper layer on the initial molybdenum substrate. This conductive copper layer is then used as a support for a multi-stack plating. Results concerning the study of the copper nucleation mechanism have been presented in a previous paper (1). In the present research work, the influence of the applied potential on the copper nucleation will be highlighted. Combining electrochemical analyses, SEM-FEG (Scanning Electron Microscopy – Field Emission Gun) imaging and nano-Auger measurements, an optimized range of potential is defined.