Improved Plasma Resistance for Porous Low-k Dielectrics by Pore Stuffing Approach-Reference-Cited by-同舟云学术

Improved Plasma Resistance for Porous Low-k Dielectrics by Pore Stuffing Approach

Published:2014-11-01 Issue:1 Volume:4 Page:N3098-N3107
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Zhang Liping,de Marneffe Jean-Francois,Heyne Markus H.,Naumov Sergej,Sun Yiting,Zotovich Alexey,el Otell Ziad,Vajda Felim,De Gendt Stefan,Baklanov Mikhail R.

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference38 articles.

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2. Plasma processing of low-k dielectrics

3. Plasma-enhanced-chemical-vapor-deposited ultralow k for a postintegration porogen removal approach

4. Post Porosity Plasma Protection: Scaling of Efficiency with Porosity

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