Plasma‐Assisted Chemical Vapor Deposition and Characterization of Boron Nitride Films
Author:
Affiliation:
1. IBM Microelectronics, Hopewell Junction, New York 12533
2. Siemens Components, IBM Facility, Essex Junction, Vermont 05452
3. Siemens AG, Process Engineering and Support, 8000 München 83, Germany
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/1.2054974/pdf
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