3D IC Designs: Myth vs. Reality

Abstract

Through Silicon Via (TSV) is an emerging technology for 3D integration. The design flow, supply chain, and infrastructure of semiconductor industry will be reconstructed because of this technique. Using this technique, the path to "More-than-Moore" era seems to be smooth and promising. However In this paper, we try to give our reflective judgment to this hottest topic. 4 basic myths will be inspected and contradicted based on experimental and statistic data we observed. In this paper, we will discuss about the myths including the arguments on the issues of necessity, length, parasitic value, and EDA tools for TSVs.