Delamination Behavior Along Interface between Submicron Thick Polymer Film and Substrate under Creep-Reference-Cited by-同舟云学术

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Delamination Behavior Along Interface between Submicron Thick Polymer Film and Substrate under Creep

Published:2016 Issue:2 Volume:65 Page:176-181
ISSN:0514-5163
Container-title:Journal of the Society of Materials Science, Japan
language:en
Short-container-title:J. Soc. Mat. Sci., Japan

Author:

KAWAI Emi¹,SUMIGAWA Takashi¹,KITAMURA Takayuki¹

Affiliation:

1. Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

Publisher

Society of Materials Science, Japan

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/jsms/65/2/65_176/_pdf

Reference23 articles.

1. 1) Bogy DB, “Edge bonded dissimilar orthogonal elastic wedges under normal and shear loading”, Journal of Applied Mechanics, Vol.35, pp.460-466 (1968).

2. 2) R.Yuuki and S.B.Cho, “Boundary element analysis of stress intensity factors for an interface crack in dissimilar materials”, Transactions of the Japan Society of Mechanical Engineerings Series A, Vol.55, No.510, pp.340-347 (1989).

3. 3) T.L.Becker Jr., J.M.McNaney, R.M.Cannon and R.O.Ritchie, “Limitations on the use of the mixed-mode delaminating beam test specimen: Effects of the size of the region of K-dominance”, Mechanics of Materials, Vol.25, pp.291-308 (1997).

4. 4) A.Kinbara, E.Kusano, T.Kamiya, I.Kondo and O.Takenaka, “Evaluation of adhesion strength of Ti films on Si(100) by the internal stress method”, Thin Solid Films, Vol.317, pp.165-168 (1998).

5. 5) R.H.Dauskardt, M.Lane, Q.Ma and N.Krishna, “Adhesion and debonding of multi-layer thin film structures”, Engineering Fracture Mechanics, Vol.61, pp.141-162 (1998).

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