The Fabrication of an Applicative Device for Trench Width and Depth Using Inductively Coupled Plasma and the Bulk Silicon Etching Process
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Published:2014-02-25
Issue:1
Volume:15
Page:49-54
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ISSN:1229-7607
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Container-title:Transactions on Electrical and Electronic Materials
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language:en
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Short-container-title:Transactions on Electrical and Electronic Materials
Author:
Woo Jong-Chang,Choi Chang-Auck,Kim Chang-Il
Publisher
The Korean Institute of Electrical and Electronic Material Engineers
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials