Uncooled IRFPA with chip scale vacuum package-Reference-Cited by-同舟云学术

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Uncooled IRFPA with chip scale vacuum package

Published:2006-05-05 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Hata Hisatoshi,Nakaki Yoshiyuki,Inoue Hiromoto,Kosasayama Yasuhiro,Ohta Yasuaki,Fukumoto Hiroshi,Seto Toshiki,Kama Keisuke,Takeda Munehisa,Kimata Masafumi

Publisher

SPIE

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pixel level vacuum packaging for single layer microbolometer detectors with on pixel lens;Journal of Electrical Engineering;2022-06-01

2. Evaluation of temperature measurement using 80 × 32 silicon-on-insulator diode uncooled infrared focal plane array;Infrared Technology and Applications XLVIII;2022-05-27

3. 80×32 SOI diode-based uncooled IRFPAs for thermal detectors;Infrared Technology and Applications XLVII;2021-04-12

4. Non-Imaging Digital CMOS-SOI-MEMS Uncooled Passive Infra-Red Sensing Systems;IEEE Sensors Journal;2021-02-01

5. A Self-Calibration Method of Microbolometer With Vacuum Package;IEEE Sensors Journal;2020-08-01

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