1. Mandrel and spacer engineering based self-aligned triple patterning;Chen,2012
2. The lithographer’s dilemma: shrinking without breaking the bank;Levinson,2013
3. Levinson, H., [Principles of Lithography], SPIE, Bellingham, Washington, 425–450 (2010).
4. Modeling the transfer of line edge roughness from an EUV mask to the wafer;Gallatin,2011
5. 7nm node EUV predictive study of mask LER transference to wafer;Civay,2013