Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?

Author:

Lai Kafai1,Liu Chi-Chun1,Tsai Hsinyu1,Xu Yongan1,Chi Cheng1,Raghunathan Ananthan2,Dhagat Parul2,Hu Lin2,Park Oseo2,Jung Sunggon3,Cho Wooyong3,Morillo Jaime1,Pitera Jed1,Schmidt Kristin1,Guillorn Mike1,Brink Markus1,Sanders Daniel1,Felix Nelson1,Bailey Todd2,Colburn Matthew1

Affiliation:

1. IBM Corporation, IBM Research Division, Yorktown Heights, New York, United States

2. GlobalFoundries Inc., Hopewell Junction, New York, United States

3. Samsung Electronics Corp., Hopewell Junction, New York, United States

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference24 articles.

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4. Computational aspects of optical lithography extension by directed self-assembly

5. TSMC and Intel on the long road to EUV;Jones,2016

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