Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes
Author:
Affiliation:
1. Focuslight Technologies, Inc. (China)
Publisher
SPIE
Reference4 articles.
1. Mechanical stress-reducing heat sinks for high-power diode lasers;Scholz,2004
2. Advances in bonding technology for high power diode laser bars;Wang,2015
3. Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging
4. Investigation of indium solder interfaces for high-power diode lasers;Scholz,2003
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