Optical metrology of 3D thin film conformality by LHAR chip assisted method-Reference-Cited by-同舟云学术

Optical metrology of 3D thin film conformality by LHAR chip assisted method

Published:2022-03-05 Issue: Volume: Page:
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Container-title:Photonic Instrumentation Engineering IX
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Author:

Utriainen Mikko,Saastamoinen Kimmo,Rekola Heikki,Ylivaara Oili M. E.,Puurunen Riikka L.,Hyttinen Pasi

Publisher

SPIE

Reference8 articles.

1. Saturation profile based conformality analysis for atomic layer deposition: aluminum oxide in lateral high-aspect-ratio channels

2. Modeling growth kinetics of thin films made by atomic layer deposition in lateral high-aspect-ratio structures

3. Conformality of atomic layer deposition in microchannels: impact of process parameters on the simulated thickness profile, manuscript submitted for publication;Yim;preprint in ChemRxiv,2021

4. Evidence for low-energy ions influencing plasma-assisted atomic layer deposition of SiO2: Impact on the growth per cycle and wet etch rate

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1. Conformal High-Aspect-Ratio Solid Electrolyte Thin Films for Li-Ion Batteries by Atomic Layer Deposition;ACS Applied Electronic Materials;2024-03-08

2. Excellent conformality of atmospheric-pressure plasma-enhanced spatial atomic layer deposition with subsecond plasma exposure times;Applied Physics Letters;2023-10-30

3. Characterization of PillarHall test chip structures using a reflectometry technique;Measurement Science and Technology;2023-06-19

4. 3D Thin Film Metrology without Cross-Sectional Sampling;2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM);2023-05